With the latest additions to Nexperia’s dual automotive MOSFET portfolio in LFPAK56D, designers have significant space savings with all the thermal benefits of copper clip.
Space constraints have increasingly become a headache in the automotive world. Combining that with the thermally demanding application space of the engine compartment, results in a real semiconductor packaging challenge. Drawing on our proven automotive qualified LFPAK gull-wing copper clip package technology, Nexperia can house two high-performance MOSFETs in a single LFPAK56D package.
The release of a new range of 80 V dual Power-SO8 MOSFETs in the popular LFPAK56D package, now means you can truly optimise your design for performance, flexibility and size. For example, as a dual device package it literally halves the space required for two single Power-SO8 devices or alternatively it occupies 77% less space than two DPAKs. The LFPAK56D also offers exceptional board level reliability in thermally demanding applications such as engine management, transmission control and ABS systems.
LFPAK56D – The ultimate dual automotive MOSFET
