• Logic
  • Automotive
May 14, 2019

Miniaturizing logically with leadless MicroPak and leaded PicoGate ...

Mini Logic packages are up to 15X smaller than conventional SO packages, saving significant footprint in space-constrained applications like mobile –and now in Automotive too.Read more

  • Automotive
  • MOSFETs
May 06, 2019

LFPAK ups power efficiency with new 8 x 8 footprint

As the industry demands more space savings, power density and current handling capabilities, Nexperia’s latest copper clip package delivers significant improvements. ...Read more

  • Logic
  • quality
April 10, 2019

How our package logic always matches your manufacturing strategy

When selecting logic packages for a design, package maturity needs to be considered to obtain an optimal balance of performance/size, longevity and affordability. Popular ...Read more