When it comes to selecting a MOSFET, the headline figure most engineers look for is the RDS(on) value. But for high-volume consumer, computing, mobile and even industrial sub-systems, the changing needs of design engineers require a holistic approach that combines efficiency, size, performance, reliability and cost-effectiveness. So reliably delivering the right RDS(on) in the right small footprint package and at the right price point is the key for many power supplies, chargers, Battery Management Systems (BMS) and motor drivers. That’s exactly what Nexperia’s latest range of 60 V MOSFETs in MLPAK33 offers.
The landscape for high-volume electronics has been changing dramatically, particularly when it comes to power requirements. One of the most notable changes has undoubtedly been the shift from corded mains-powered to rechargeable battery-powered devices. That has required a rise in system power density and higher efficiency, while making devices lighter and significantly reducing the available space for increasingly complex circuitry. And of course, all this must be done while ensuring safe and reliable operation but still pushing down on Bill of Material (BoM) costs.
Robot vacuum cleaners are perhaps the ideal example of the demands many engineers face today. Not only do they incorporate power conversion and battery management, they also have a 3-phase vacuum motor, wheel motors and actuators for locks and valves in addition to all the sensing, control and communications circuitry. That requires a lot of power to be packed onto very tight PCB real estate, often in multi-layer designs. And it has clearly impacted the selection criteria designers have when it comes to power MOSFETs for power supplies, chargers, BMS and motor drivers.
Combining optimized and space-saving
Nexperia’s MLPAK56 MOSFETs took the first step in expanding our proven power superjunction MOSFET portfolio (NextPowerS3, NextPower 80/100V and Application Specific MOSFETs) to address these almost opposing requirements. With this new family of MLPAK33 MOSFETs, Nexperia gives design engineers of high-volume, cost-conscious applications the optimized switching performance (RDS(on) < 10 mΩ) they require in a compact (10.9 mm²) footprint, while maintaining the benefits of Nexperia’s quality, reliability, engineering expertise and supply chain stability.
To achieve this optimal balance, Nexperia has combined Split Gate Trench (SGT) MOSFET technology and our MLPAK (micro-lead package). SGT technology delivers excellent switching performance at the same time as allowing higher current densities in smaller packages. While the MLPAK33 is fully footprint compatible with the industry recognized surface-mount DFN3333, it has the added benefit of micro-leads for more reliable mounting. This makes our 60 V MLPAK33 MOSFETs the ideal match for the changing demands of high-volume applications, such as robot vacuum cleaners and 30 W wired and wireless fast charging adaptors as well as a range of DC/DC converters.
Check out our MLPAK33 MOSFETs family page for more information.